Description
B760M GAMING WIFI PLUS
- Supports 14th/13th/12th generation Intel® Core™ processors
- Unmatched performance: Hybrid Digital VRM with 4+1+1 Phases
- Dual Channel DDR4: Supports 4* XMP DIMM Memory Modules
- Next-generation storage: 2*M.2 PCIe 4.0 x4 connectors
- Fast network connections: i-Fi 6 802.11ax, GbE LAN
- Extensive connectivity: Front USB-C® 5Gb/s, DP, HDMI
- Smart Fan 6: Multiple temperature sensors and hybrid fan connectors with FAN STOP
- Q-Flash Plus: BIOS update without installing the processor, memory, and graphics card

PREVIEW

8-pin Solid Pin CPU Power Connector
2 x M.2 connectors for high-performance storage
- 2*PCIe 4.0 x4 M.2
Audio Solution
- 8-channel HD audio
- Audio Noise Guard
- High-end audio capacitors
PCIe EZ-Latch
DDR4 Dual Channel, 4 DIMMs
Supports
14th, 13th and 12th Generation processorsUSB 3.2 Gen1 Type-C on the front
802.11ax Wi-Fi
HDMI
1*DisplayPort
RGB FUSION
- 1*Addressable RGB LED Connectors
- 1*RGB LED Connectors
GbE LAN
Q-FLASH Plus Button
4*SATA 3
Hybrid Digital VRM 4+1+1
- PCIe 4.0 Ready PCB
- Premium quality coil and capacitor
Designed entirely in PCIe 4.0
- 1* PCIe 4.0 x16 port
- 2*PCIe 4.0 x4 M.2 connectors

Sustainable Performance
GIGABYTE Ultra Durable™ motherboards, built with optimal components inside, offer top-tier performance and a timeless platform.
Digital VRM Design
The best VRM ever designed with the highest quality components.
• PWM 4+2+1 Digital Phases + Low RDS(on) MOSFETs
• They support the latest CPUs, improve system performance and ensure maximum hardware scalability.
* Photo for illustrative purposes only.

XMP DDR4
DDR4 XMP support up to 5333 MHz and beyond* GIGABYTE offers a tried and tested platform that ensures proper compatibility with profiles up to 5333 MHz and beyond. All users need to do to achieve this performance boost is ensure their memory module is XMP-compatible and that the XMP function is enabled on their GIGABYTE motherboard.
* XMP profile support may vary depending on the memory module.
Please refer to the complete list of validated memory devices. Product specifications may vary by model.

Thermal
Heat sink for MOSFET with expanded surface area
The expanded surface area design of the MOSFET heat sink greatly improves heat dissipation.



















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